Alchip Technologies, Ltd. recently showcased its accomplishments and plans for the future at TSMC’s 2024 Technology Symposium exhibit in Santa Clara, CA, and Workshop in Austin, TX. During the event, the company emphasized its expertise in high-performance computing design and its success in managing multiple complex projects.
Alchip highlighted its full reticle size designs exceeding 800mm² and utilizing cutting-edge FinFET technology. The company’s engineers detailed their record-setting advanced package production, including CoWoS® designs on advanced nodes, high power levels, reticle interposers, and large packages in production. Additionally, Alchip emphasized its strong industry partnerships, such as its involvement with TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies provides silicon and design services for system companies developing complex ASICs and SoCs. The company offers solutions for SoC design at mainstream and advanced process technology, enabling faster time-to-market and cost-effectiveness. Customers of Alchip include global leaders in various electronic product categories. In addition to participating in TSMC NA Technology Workshops in Boston, MA